2D and 3D inspection of BGA soldering joints on printed circuit boards
A ball-grid array (BGA) is a form of housing in which the connections are not visible and lie on the bottom of the housing. As a result, a complete quality inspection of the soldering joints is possible only with the help of X-ray technology.
2D microfocus X-ray technology from YXLON enables the rapid and detailed evaluation of BGAs, from research & development all the way to series inspection during production. It reveals typical defects such as blowholes, short-circuits, solder ball lift, microcracks or deformed solder balls. Any of these can lead to electronic system failure or declining reliability.
Microfocus computed tomography (μCT) enables a deeper view into the three-dimensional structure, even in the tiniest components and assemblies, and supplies additional information about the defects, for instance the volume size of blowholes, ball shear size when a solder ball has lifted, or the pad surface structure in the case of an unsoldered solder ball. This supplementary information simplifies the analysis of the causes of defects.
The X-ray systems Y.Cheetah and Y.Cougar have both technologies.
We offer you a wide range of X-ray techniques at our application centers. We design solutions that replace X-ray films, provide radioscopy and fully automatic defect recognition in X-ray images, as well as computed tomography services for scanning inspection items ranging from micro-CT to CT using a linear accelerator.