Multilayer Printed Circuit Board (PCB)
YXLON X-ray inspection technology is used in the production of multilayer printed circuit boards to measure the position offset and minimal residual ring width. High quality X-ray images in oblique view allow for the detailed observations.
- Visualization of individual layers
- Detection of defects
- Detection of failures
As an example, X-ray imaging can detect etching or layout errors, shorts caused by faulty interconnects and poor metallization of contact holes.
Assembled Printed Circuit Boards (PCB)
High-resolution YXLON X-ray imaging is widely used in failure analysis and production quality testing of electronic components such as solder joint inspection. X-ray images help identify material defects and quality characteristics that influence the shape of the solder joint.
- Missing solder fillings
- Missing solder connections
- Solder voids
- Solder bridges
- Mistakes due to lack of wetting
With the semi-automatic testing software on YXLON industrial X-ray inspection systems, quick and easy ‘teach-in’ programming is possible, as well as the highest fault coverage and repeatability.