Packing more miniaturized devices onto substrates with decreasing real estate is today common practice in the world of electronics. At the same time, the commoditization and short product lifecycle force each step of the Surface Mount Technology (SMT) production line to maintain yield without sacrificing quality. The complexity of this manufacturing process, and the products it constructs, is continuously advancing due to the increased number of components and layers on Printed Circuit Boards (PCB). Consequently, the number of possible defects, such as component misalignment, contamination, bad solder joints, broken traces, and die attach voids, also becomes greater.
The possibilities of traditional inspection methods such as optical inspection and in-circuit test are limited when the joints cannot be seen with the naked eye because they are hidden, either under the component such as BGA and QFN devices, buried in the board such as with plated through-holes, or encapsulated in a package such as flip chip and wire bonded components, and 3D stacked packages. Additionally, new manufacturing challenges, such as lead-free manufacturing, 01005 components, and high-density assembly are pushing the limits of conventional inspection tools. For these cases YXLON offers highly reliable microfocus X-ray inspection systems to fulfil the needs of the electronics industry. Advanced technologies such as oblique viewing, Tue X-ray Intensity Control (TXI), and high magnification / high resolution real-time imaging increase the productivity and utilization of an microfocus X-ray system.
