Inspection of Metal Additive Manufacturing

Starting out mainly as a prototyping technology Additive Manufacturing (AM) gained tremendous momentum for  use in industrial applications over the last 5 years. For highly demanding functional parts, laser beam powder bed fusion (LB-PBF) became the most dominant AM technology.
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Advances in X-Ray Inspection For Electronics, Part 3: Microelectronics

As new technologies emerge, they push x-ray systems to evolve and adopt new methods of imaging in difficult materials and locations. One of today's more prevalent and demanding areas that x-ray systems has been able to provide a solution is in microelectronics. 
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Advances in X-ray Inspection for Electronics, Part 2: Which Tube?

Within the realm of X-ray inspection for electronics there are a wide range of applications, so a single type of X-ray tube is not a "one-size-fits-all" solution. To address the demands of industries such as electronics manufacturing, better X-ray system manufacturers offer various non-destructive test solutions based on the power, kV and feature recognition capabilities electronics producers need.
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Advances in X-ray Inspection for Electronics, Part 1: Tubes

The “open” transmission X-ray tube was a major step forward for x-ray inspection. This technology itself is  almost 55 years old, but was adopted for X-ray inspection for electronics in 1982 when the German company Feinfocus introduced the first open Microfocus tube. Most  modern high technology electronics systems use Open Tubes.

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