YXLON International Wins Mexico Technology Award for FF70 CL 2D-3D X-ray

YXLON International, a company of the Swiss tech holding Comet Group, is pleased to announce that it has been awarded a prestigious Mexico Technology Award in the category of Inspection – X-ray for its YXLON FF70 CL Highest resolution advanced 2D and 3D X-ray system. The award was presented to the company during a Wednesday, Oct. 23, 2019 ceremony that took place during the SMTA Guadalajara Expo & Tech Forum.
Semiconductor manufacturing requires automated, high-quality, reliable, fast and non-destructive inspection and analysis for optimum production as flaws can be found on the wafer, on a substrate, in a strip in the sub-assembly or in the final device. The new YXLON FF70 CL X-ray inspection system has been specifically developed to enable the very best automated analysis of the smallest and most demanding features within these samples. The result: impressively precise and reproducible test and inspection excellence.
 
The YXLON FF70 CL is distinguished by its large inspection area of 510 x 610 mm and the extreme detail volume detectability of < 0,3 µm³, making it ideal for automatically and non-destructively analyzing solder bumps and filled vias in 3D ICs, flip chips and wafers.
 
The FF70 CL provides 2D (top-down) with a high-performance flat-panel and 3D (CL-Computed Laminography) automated analysis using a high-resolution Image Intensifier within a special manipulation assembly for its inclined rotations.
 
The Mexico Technology Awards recognize the best new innovations in the electronics manufacturing industry in Mexico. The goal of the award program is to celebrate the companies and people that are achieving the highest standards and driving the industry forward.




 
Media Relations
Gina Naujokat
Marketing Communications
T +49 40 52729 404
gina.naujokat@hbg.yxlon.com