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Limitations of 2D x-ray inspection

What you will learn in this paper:

  • What level of x-ray inspection is needed on different components
  • How laminography separates layers on double-sided components, and evaluates solder presence
  • Void calculation on multilayer, double-sided boards
  • Determining the actual fill level of THT components
  • Time saving failure analysis of BGA’s; micro3Dslice vs CT scan

Fill out the form on this page to download your copy of the whitepaper today.


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